- Packaging：
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- Voltage - Supply：
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- Supplier Device Package：
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- Features：
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- Memory Size：
-
- Voltage - Supply, Battery：
-
- Current - Timekeeping (Max)：
-
- Ausgewählte Bedingungen:
Entdecken Sie 25 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Supplier Device Package | Features | Memory Size | Voltage - Supply, Battery | Current - Timekeeping (Max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Voltage - Supply | Supplier Device Package | Features | Memory Size | Voltage - Supply, Battery | Current - Timekeeping (Max) | |
|
|
|
Microchip Technology |
3,300
|
3 tage |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
Microchip Technology |
5,301
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
Microchip Technology |
5,301
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
NXP USA Inc. |
64,000
|
3 tage |
-
|
MOQ: 4000 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SON
|
Tape & Reel (TR) | 0.9 V ~ 5.5 V | 8-HWSON (2x3) | Alarm，Leap Year，Square Wave Output | - | - | 0.6μA @ 3.3V | ||
|
|
|
NXP USA Inc. |
65,567
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SON
|
Cut Tape (CT) | 0.9 V ~ 5.5 V | 8-HWSON (2x3) | Alarm，Leap Year，Square Wave Output | - | - | 0.6μA @ 3.3V | ||
|
|
|
NXP USA Inc. |
65,567
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-SON
|
- | 0.9 V ~ 5.5 V | 8-HWSON (2x3) | Alarm，Leap Year，Square Wave Output | - | - | 0.6μA @ 3.3V | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
Microchip Technology |
3,287
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
Microchip Technology |
3,287
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
|
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC RTC MOD LOW POWER 8TDFN
|
Tape & Reel (TR) | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | Leap Year，NVSRAM，Square Wave Output | 56B | 1.5 V ~ 3.7 V | 125μA @ 2.7V ~ 5.5V | ||
|
|
|
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RTC MOD LOW POWER 8TDFN
|
Cut Tape (CT) | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | Leap Year，NVSRAM，Square Wave Output | 56B | 1.5 V ~ 3.7 V | 125μA @ 2.7V ~ 5.5V | ||
|
|
|
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RTC MOD LOW POWER 8TDFN
|
- | 2.7 V ~ 5.5 V | 8-TDFN (2x3) | Leap Year，NVSRAM，Square Wave Output | 56B | 1.5 V ~ 3.7 V | 125μA @ 2.7V ~ 5.5V | ||
|
|
|
Diodes Incorporated |
Anfrage
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output | - | - | 0.8μA @ 1.3V ~ 1.8V | ||
|
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM，Unique ID | 64B，1Kb | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | ||
|
|
Microchip Technology |
6,600
|
3 tage |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | - | 1μA @ 5.5V | |||
|
|
Microchip Technology |
6,713
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | - | 1μA @ 5.5V | |||
|
|
Microchip Technology |
6,713
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | - | 1μA @ 5.5V | |||
|
|
Microchip Technology |
Anfrage
|
- |
-
|
MOQ: 3300 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Tape & Reel (TR) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | |||
|
|
Microchip Technology |
668
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
Cut Tape (CT) | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V | |||
|
|
Microchip Technology |
668
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC RTC CLK/CALENDAR I2C 8-TDFN
|
- | 1.8 V ~ 5.5 V | 8-TDFN (2x3) | Alarm，Leap Year，Square Wave Output，SRAM | 64B | 1.3 V ~ 5.5 V | 1.2μA @ 3.3V |
