- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Output：
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- Frequency - Max：
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- Ausgewählte Bedingungen:
Entdecken Sie 10 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Frequency - Max | Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Frequency - Max | Type | |
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ON Semiconductor |
Anfrage
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- |
-
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MOQ: 160 MPQ: 1
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IC CLK BUFFER 2:15 1.5GHZ 52LQFP
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Tray | 100LVE | 3 V ~ 5.25 V | -40°C ~ 85°C | 52-LQFP | 52-LQFP (10x10) | LVECL，LVPECL | ECL | 1.5GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | ||
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ON Semiconductor |
Anfrage
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- |
-
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MOQ: 1500 MPQ: 1
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IC CLK BUFFER 2:15 1.5GHZ 52LQFP
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Tape & Reel (TR) | 100LVE | 3 V ~ 5.25 V | -40°C ~ 85°C | 52-LQFP | 52-LQFP (10x10) | LVECL，LVPECL | ECL | 1.5GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | ||
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IDT，Integrated Device Technology Inc |
Anfrage
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- |
-
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MOQ: 160 MPQ: 1
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IC CLK BUFFER 2:15 3GHZ 52PTQFP
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Tray | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL，PECL | LVPECL | 3GHz | Fanout Buffer (Distribution)，Divider，Multiplexer，PLL | ||
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IDT，Integrated Device Technology Inc |
Anfrage
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- |
-
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MOQ: 1500 MPQ: 1
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IC CLK BUFFER 2:15 3GHZ 52PTQFP
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Tape & Reel (TR) | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL，PECL | LVPECL | 3GHz | Fanout Buffer (Distribution)，Divider，Multiplexer，PLL | ||
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Microchip Technology |
1,000
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3 tage |
-
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MOQ: 1000 MPQ: 1
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2.5V/3.3V INTEGRATED DIVIDER + F
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Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | LVPECL | 2GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
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Microchip Technology |
1,000
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3 tage |
-
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MOQ: 1 MPQ: 1
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2.5V/3.3V INTEGRATED DIVIDER + F
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Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | LVPECL | 2GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
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Microchip Technology |
1,000
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3 tage |
-
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MOQ: 1 MPQ: 1
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2.5V/3.3V INTEGRATED DIVIDER + F
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- | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | LVPECL | 2GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
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Microchip Technology |
Anfrage
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- |
-
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MOQ: 160 MPQ: 1
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IC CLK BUFFER 2:15 2GHZ 64TQFP
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Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | LVPECL | 2GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
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Microchip Technology |
Anfrage
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- |
-
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MOQ: 160 MPQ: 1
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IC CLK BUFFER 2:15 2GHZ 64TQFP
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Tray | Precision Edge | 2.375 V ~ 2.625 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | CML，LVDS，PECL | LVDS | 2GHz | Fanout Buffer (Distribution)，Divider，Multiplexer | |||
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NXP USA Inc. |
Anfrage
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- |
-
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MOQ: 160 MPQ: 1
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IC CLK BUFFER 2:15 3GHZ 52LQFP
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Tray | 100ES | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-LQFP (10x10) | ECL，PECL | ECL，PECL | 3GHz | Fanout Buffer (Distribution)，Divider，Multiplexer |
