- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Input:
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- Output:
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- Ratio - Input:Output:
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- Frequency - Max:
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- Mounting Type:
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- Ausgewählte Bedingungen:
Entdecken Sie 11 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Ratio - Input:Output | Frequency - Max | Mounting Type | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Ratio - Input:Output | Frequency - Max | Mounting Type | Type | ||
IDT,Integrated Device Technology Inc |
380
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FANOUT BUFFER 1-10 32VFQFPN
|
Tray | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | HCSL,LVDS,LVPECL,Crystal | LVCMOS,LVTTL | 0.1319444444444444 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
ON Semiconductor |
1,000
|
3 tage |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 2:5 200MHZ 24QFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,SSTL,Crystal | LVCMOS,LVTTL | 0.08680555555555557 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
ON Semiconductor |
1,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 200MHZ 24QFN
|
Cut Tape (CT) | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,SSTL,Crystal | LVCMOS,LVTTL | 0.08680555555555557 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
ON Semiconductor |
1,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 200MHZ 24QFN
|
- | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,SSTL,Crystal | LVCMOS,LVTTL | 0.08680555555555557 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microsemi Corporation |
385
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
Tray | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,HCSL,LVCMOS,LVDS,LVPECL,SSTL | LVCMOS | 0.1319444444444444 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microsemi Corporation |
490
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
Tray | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,HCSL,LVCMOS,LVDS,LVPECL,SSTL | LVCMOS | 0.1319444444444444 | 250MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
ON Semiconductor |
Anfrage
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK BUFFER 2:5 200MHZ 24QFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,SSTL,Crystal | LVCMOS,LVTTL | 0.08680555555555557 | 200MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
- | -40°C ~ 85°C | - | - | CML,HCSL,LVCMOS,LVDS,LVPECL,SSTL | LVCMOS | 0.1319444444444444 | 200MHz | - | Fanout Buffer (Distribution),Multiplexer | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 4000 MPQ: 1
|
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
- | -40°C ~ 85°C | - | - | CML,HCSL,LVCMOS,LVDS,LVPECL,SSTL | LVCMOS | 0.1319444444444444 | 250MHz | - | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
NETWORK TIMING
|
- | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,Crystal | LVCMOS,LVTTL | 0.1319444444444444 | 200MHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUF 2:4 250MHZ 32VFQFPN
|
Tape & Reel (TR) | -40°C ~ 85°C (TA) | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | HCSL,LVCMOS,LVDS,LVPECL,LVTTL,Crystal | LVCMOS,LVTTL | 0.1319444444444444 | 200MHz | Surface Mount | Fanout Buffer (Distribution) |