- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Main Purpose：
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- Ratio - Input:Output：
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- Differential - Input:Output：
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- Ausgewählte Bedingungen:
Entdecken Sie 51 -Produkte
 |
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Input | Output | Ratio - Input:Output | Differential - Input:Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Input | Output | Ratio - Input:Output | Differential - Input:Output | |
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Silicon Labs |
813
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLOCK MULT 2KHZ-150MHZ 36VQFN
|
Tray | DSPLL | 1.71 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet (WAN)，SONET/SDH/STM，Video | Clock | CML，CMOS，LVDS，LVPECL | 0.08472222222222221 | Yes/Yes | ||
|
|
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Silicon Labs |
Anfrage
|
- |
-
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MOQ: 2500 MPQ: 1
|
IC CLOCK MULT 2KHZ-150MHZ 36VQFN
|
Tape & Reel (TR) | DSPLL | 1.71 V ~ 3.63 V | -40°C ~ 85°C | 36-VFQFN Exposed Pad | 36-QFN (6x6) | Yes | Ethernet (WAN)，SONET/SDH/STM，Video | Clock | CML，CMOS，LVDS，LVPECL | 0.08472222222222221 | Yes/Yes | ||
|
|
IDT，Integrated Device Technology Inc |
3,000
|
3 tage |
-
|
MOQ: 3000 MPQ: 1
|
IC Z-BUFFER LOW POWER 64QFN
|
Tape & Reel (TR) | - | 1.05 V ~ 3.3 V | 0°C ~ 70°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | Yes | Intel QPI，PCI Express (PCIe) | Clock | HCSL | 0.05 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
3,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC Z-BUFFER LOW POWER 64QFN
|
Cut Tape (CT) | - | 1.05 V ~ 3.3 V | 0°C ~ 70°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | Yes | Intel QPI，PCI Express (PCIe) | Clock | HCSL | 0.05 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
3,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC Z-BUFFER LOW POWER 64QFN
|
- | - | 1.05 V ~ 3.3 V | 0°C ~ 70°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | Yes | Intel QPI，PCI Express (PCIe) | Clock | HCSL | 0.05 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
2,450
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20-VFQFPN
|
Tube | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
3,000
|
3 tage |
-
|
MOQ: 3000 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
3,716
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
3,716
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
- | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
444
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20VQFN
|
Tube | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
305
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Tube | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
247
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC Z-BUFFER LOW POWER 64QFN
|
Tray | - | 1.05 V ~ 3.3 V | 0°C ~ 70°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | Yes | Intel QPI，PCI Express (PCIe) | Clock | HCSL | 0.05 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
1,032
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20TSSOP
|
Tube | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
203
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC Z-BUFFER LOW POWER 64QFN
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 64-VFQFN Exposed Pad | 64-VFQFPN (9x9) | Yes | Intel QPI，PCI Express (PCIe) | Clock | HCSL | 0.05208333333333334 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
2,097
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
2,097
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
- | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
Anfrage
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Tape & Reel (TR) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
1,917
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | |||
|
|
IDT，Integrated Device Technology Inc |
1,917
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
- | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes |
