- Series:
-
- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Ratio - Input:Output:
-
- Frequency - Max:
-
- Mounting Type:
-
- Ausgewählte Bedingungen:
Entdecken Sie 4 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Ratio - Input:Output | Frequency - Max | Mounting Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Ratio - Input:Output | Frequency - Max | Mounting Type | ||
Connor-Winfield |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC CLK TIME MODULE ETHERNET
|
Bulk | MSTM-S3 | 4.75 V ~ 5.25 V | 0°C ~ 50°C | 18-DIP Module | - | 0.08472222222222221 | 16.384MHz | Through Hole | ||||
Connor-Winfield |
Anfrage
|
- |
-
|
MOQ: 10 MPQ: 1
|
IC CLK TIME MODULE ETHERNET
|
Bulk | MSTM-S3 | 4.75 V ~ 5.25 V | 0°C ~ 50°C | 18-DIP Module | - | 0.08472222222222221 | 19.44MHz | Through Hole | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC TIMING-OVER-PACKET 256TEBGA-2
|
Tray | - | - | -40°C ~ 85°C | 256-BGA | 256-BGA (17x17) | 0.4638888888888889 | 125MHz | Surface Mount | ||||
Microsemi Corporation |
Anfrage
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC TIMING-OVER-PACKET 256TEBGA-2
|
Tray | - | - | -40°C ~ 85°C | 256-BGA | 256-BGA (17x17) | 0.4638888888888889 | 125MHz | Surface Mount |