- Series：
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- Features：
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- Dimensions - Overall：
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- Product Type：
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- Ausgewählte Bedingungen:
Entdecken Sie 76 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Features | Dimensions - Overall | Product Type | Power - Cooling | Thermal Resistance @ GPM | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Series | Features | Dimensions - Overall | Product Type | Power - Cooling | Thermal Resistance @ GPM | |
|
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Aavid，Thermal Division of Boyd Corporation |
47
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.01C/W
|
Hi-Contact | - | 15.19" L x 7.00" W x 0.60" H (385.8mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | 0.010°C/W @ 1.0 GPM | ||
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|
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Wakefield-Vette |
29
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 9.19" L x 7.00" W x 0.60" H (233.4mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
119
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
STANDARD VAPOR CHAMBER 113.1X81.
|
VC | VGA Platform | 4.45" L x 3.22" W x 0.22" H (113.1mm x 81.8mm x 5.7mm) | Vapor Chamber | 180W | - | ||
|
|
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Aavid，Thermal Division of Boyd Corporation |
50
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.02C/W
|
Hi-Contact | - | 9.00" L x 5.00" W x 0.60" H (228.6mm x 127.0mm x 15.2mm) | Passive，Cold Plate | - | 0.020°C/W @ 1.0 GPM | ||
|
|
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Aavid，Thermal Division of Boyd Corporation |
25
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.006C/W
|
Hi-Contact | - | 27.19" L x 7.00" W x 0.60" H (690.6mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | 0.006°C/W @ 1.0 GPM | ||
|
|
|
Wakefield-Vette |
14
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 27.19" L x 7.00" W x 0.60" H (690.6mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
26
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
61
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 5.25" L x 2.25" W x 0.66" H (133.4mm x 57.2mm x 16.8mm) | Passive，Cold Plate | - | - | ||
|
|
|
Aavid，Thermal Division of Boyd Corporation |
32
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.06C/W
|
Hi-Contact | - | 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm) | Passive，Cold Plate | - | 0.060°C/W @ 1.5 GPM | ||
|
|
|
Aavid，Thermal Division of Boyd Corporation |
8
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK 0.0055C/W
|
Hi-Contact | - | 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm) | Passive，Cold Plate | - | 0.0055°C/W @ 2.0 GPM | ||
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|
|
Wakefield-Vette |
11
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 9.19" L x 7.00" W x 0.60" H (233.4mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
20
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 15.00" L x 5.00" W x 0.66" H (381.0mm x 127.0mm x 16.8mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
20
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 15.19" L x 7.00" W x 0.60" H (385.8mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
11
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 27.19" L x 7.00" W x 0.60" H (690.6mm x 177.8mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
22
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 9.00" L x 5.00" W x 0.66" H (228.6mm x 127.0mm x 16.8mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
21
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
24
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK BURIED
|
- | - | 9.00" L x 5.00" W x 0.60" H (228.6mm x 127.0mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
20
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
COLD PLATE HEAT SINK EXPOSED
|
- | - | 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm) | Passive，Cold Plate | - | - | ||
|
|
|
Wakefield-Vette |
47
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
STANDARD VAPOR CHAMBER 90X90X3.0
|
VC | Intel 2011 Square Platform | - | Vapor Chamber | 150W | - | ||
|
|
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Wakefield-Vette |
44
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
STANDARD VAPOR CHAMBER 106X70X3M
|
VC | Intel 2011 Narrow Platform | - | Vapor Chamber | 150W | - |
