- Material：
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- Shape：
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- Length：
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- Width：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Ausgewählte Bedingungen:
Entdecken Sie 429 -Produkte
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | Bolt On | TO-220 | 1.000" (25.40mm) | 6.0W @ 30°C | 1.50°C/W @ 500 LFM | 4.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK
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Board Level | Aluminum | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 30°C | 1.50°C/W @ 600 LFM | 5.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Clip and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | - | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | - | Bolt On | TO-3 | 0.500" (12.70mm) | 3.0W @ 50°C | 3.00°C/W @ 600 LFM | 15.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | 0.745" (18.92mm) | - | Clip | TO-202 | 0.420" (10.67mm) | 1.5W @ 40°C | 11.00°C/W @ 400 LFM | 24.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 1.220" (30.99mm) | 1.000" (25.40mm) | - | Clip | Multiwatt, SIP | 0.500" (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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-
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MOQ: 1 MPQ: 1
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HEATSINK 18-DIP BLK ANODIZED
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Top Mount | Aluminum | Rectangular, Fins | 1.125" (28.58mm) | 0.700" (17.78mm) | - | Press Fit, Slide On | 18-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-218 | 1.000" (25.40mm) | 20.0W @ 60°C | 1.00°C/W @ 800 LFM | 8.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | - | Bolt On and PC Pin | TO-220 | 0.640" (16.26mm) | 3.0W @ 50°C | 5.00°C/W @ 200 LFM | 16.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Anfrage
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | - | Clip and PC Pin | TO-220 | 1.000" (25.40mm) | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.70°C/W | Black Anodized |
