- Packaging:
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- Series:
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- Operating Temperature:
-
- Package / Case:
-
- Type:
-
- Frequency:
-
- Features:
-
- Impedance:
-
- Size / Dimension:
-
- Frequency Stability:
-
- Frequency Tolerance:
-
- Ausgewählte Bedingungen:
Entdecken Sie 33 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Type | Frequency | Features | Impedance | Size / Dimension | Capacitance | Frequency Stability | Frequency Tolerance | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Packaging | Series | Operating Temperature | Package / Case | Type | Frequency | Features | Impedance | Size / Dimension | Capacitance | Frequency Stability | Frequency Tolerance | ||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
9,000
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Tape & Reel (TR) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | ±75kHz | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
14,165
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Cut Tape (CT) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | ±75kHz | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
14,165
|
3 tage |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
- | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | ±75kHz | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Tape & Reel (TR) | B39431 | -45°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Cut Tape (CT) | B39431 | -45°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 315.0000MHZ SMD
|
Tape & Reel (TR) | B39321 | -40°C ~ 125°C | 8-SMD | SAW | 315MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 315.0000MHZ SMD
|
Cut Tape (CT) | B39321 | -40°C ~ 125°C | 8-SMD | SAW | 315MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Tape & Reel (TR) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9200MHZ SMD
|
Cut Tape (CT) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.92MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.4200MHZ SMD
|
Tape & Reel (TR) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.42MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.4200MHZ SMD
|
Cut Tape (CT) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.42MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 25.0000MHZ 8PF SMD
|
Tape & Reel (TR) | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 25MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 25.0000MHZ 8PF SMD
|
Cut Tape (CT) | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 25MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 25.0000MHZ 8PF SMD
|
- | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 25MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 30.0000MHZ 8PF SMD
|
Tape & Reel (TR) | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 30MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 30.0000MHZ 8PF SMD
|
Cut Tape (CT) | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 30MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
TDK Corporation |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CER RES 30.0000MHZ 8PF SMD
|
- | CCR | -40°C ~ 85°C | 3-SMD,Non-Standard | Ceramic | 30MHz | Built in Capacitor | 40 Ohms | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 8pF | ±0.2% | ±0.5% | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 315.5000MHZ SMD
|
Cut Tape (CT) | B39321 | -40°C ~ 125°C | 6-SMD | SAW | 315.5MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 315.0000MHZ SMD
|
Cut Tape (CT) | B39321 | -40°C ~ 125°C | 6-SMD | SAW | 315MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - | ||||
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
SAW RES 433.9600MHZ SMD
|
Tape & Reel (TR) | B39431 | -40°C ~ 125°C | 6-SMD | SAW | 433.96MHz | - | 50 Ohms | 0.118" L x 0.118" W (3.00mm x 3.00mm) | - | - | - |