- Operating Temperature:
-
- Termination:
-
- Height Above Board:
-
- Material Flammability Rating:
-
- Contact Material:
-
- Housing Material:
-
- Connector/Contact Type:
-
- FFC,FCB Thickness:
-
- Locking Feature:
-
- Cable End Type:
-
- Ausgewählte Bedingungen:
Entdecken Sie 35 -Produkte
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Bild | Teilenummer | Hersteller | Menge | Lieferfrist | Stückpreis | Kaufen | Beschreibung | Operating Temperature | Features | Termination | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC,FCB Thickness | Locking Feature | Cable End Type | Actuator Material | ||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 9POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 9 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 4POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 4 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 8POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 8 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 8POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 8 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 7POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 7 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 7POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 7 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN BOTTOM 6POS 0.5MM SMD R/A
|
- | - | - | - | - | 6 | - | - | - | - | - | Contacts,Bottom | - | - | - | - | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 9POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 9 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC TOP 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Top | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 5POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 5 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 6POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 6 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free | ||||
Amphenol FCI |
Anfrage
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 8POS 0.50MM R/A
|
-55°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | Solder | 0.035" (0.88mm) | UL94 V-0 | 8 | Gold | 50V | Copper Alloy | Thermoplastic,Glass Filled,Halogen Free | FPC | Contacts,Bottom | 0.20mm | Flip Lock,Backlock | Notched | Thermoplastic,Glass Filled,Halogen Free |